Signal Integrity and Power Integrity

PCB Signal Integrity, Power Integrity and EMC Challenges

For PCB and package designs, the issues of crosstalk, reflections, skew, ringing and other classical signal integrity challenges are pervasive and growing. A meaningful assessment of such effects requires system-level consideration to reliably account for coupling among traces as well as planes, vias and other design structures. System-level analysis also enables consideration of power integrit...

A Co-design Methodology of Signal Integrity and Power Integrity

As PCB interconnection density and channel data rate are getting increasingly higher, various 3D effects, crosstalk, and discontinuity-induced ISI are playing a much more important role, for both signal channels and power distribution networks. In particular, noise coupling between signal trace and power delivery network has become a key issue and performance limiter for high-speed chip-to-chip...

Robust Optimization and Reflection Gain Enhancement of Serial Link System for Signal Integrity and Power Integrity

System level signal integrity and power integrity problems for high speed serial links have been explored in this paper. An example of the USB 2.0 IP has been used in this paper, but the analysis is generic for all serial links. This paper considers signal and power integrity as effects simultaneoulsy. A model is developed to optimize the performance of high speed serial link in terms of jitter...

Connectivity as a Measure of Power System Integrity

Measures of network structural integrity useful in the analysis and synthesis of power systems are discussed. Signal flow methodology is applied to derive an expression for the paths between sources and sinks in a power network. Connectivity and reach ability properties of the network are obtained using the minors of a modified connectivity matrix. Node-connectivity, branch connectivity and mix...

HyperLynx® Signal Integrity Analysis